Manufacturer
InfineonManufacturer Product Number
DD180N16SHPSA1
Description
BOND MODULE
Manufacturer Standard Lead Time
10-15
Detailed Description
BOND MODULE
| Type | Description |
|---|---|
| Category | Boxes, Enclosures, Racks andBox Components |
| Er Ji Guan Pei Zhi | SERIES CONNECTED, CENTER TAP, 2 ELEMENTS |
| Fan Xiang Current | 1000µA |
| Fan Xiang Nai Ya | 1600 V |
| Zheng Xiang Ya Jiang | 1.39V |
| Resource Type | Link |
|---|
| Attribute | Description |
|---|
| Attribute | Description |
|---|
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1+ | $ 61.3346 | |
| 5+ | $ 44.1799 | |
| 10+ | $ 43.9529 | |
| 50+ | $ 43.7273 | |
| 100+ | $ 43.5003 |
Minimum:1/Multiple:1
Total amount: