Manufacturer
SiliconManufacturer Product Number
BGM13S22F512GN-V3
Description
藍芽模組(802.15.1) BGM13S Bluetooth SiP Module, 2.4GHz, 512kB Flash, +8dBm, External Antenna
Manufacturer Standard Lead Time
10-15
Detailed Description
| Type | Description |
|---|---|
| Category | Boxes, Enclosures, Racks andBox Components |
| Operating Temperature | -40℃~+85℃ |
| Operating Voltage | 1.8V~3.8V |
| Fa She Current | 8.9mA |
| Jie Shou Current | 9.7mA |
| Jie Kou | I2C, UART |
| Xie Yi | Bluetooth5.0 |
| He Xin Xin Pian | ARM Cortex M4 |
| Tian Xian Type | Chip |
| Resource Type | Link |
|---|
| Attribute | Description |
|---|
| Attribute | Description |
|---|
| Quantity | Unit Price | Ext Price |
|---|---|---|
| 1+ | $ 9.7701 | |
| 5+ | $ 9.7645 | |
| 10+ | $ 9.7617 | |
| 50+ | $ 9.7576 | |
| 100+ | $ 9.7548 | |
| 250+ | $ 9.5612 |
Minimum:1/Multiple:1
Total amount: