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Image shown is a representation only. Exact specifications should be obtained from the product data sheet.

BGM210PB22JIA2R

Manufacturer

Silicon

Manufacturer Product Number

BGM210PB22JIA2R

Description

BGM210PB WIRELESS GECKO MODULE,

Manufacturer Standard Lead Time

10-15

Detailed Description

BGM210PB WIRELESS GECKO MODULE,

Datasheet

Product Attributes

Type	Description
Category	Boxes, Enclosures, Racks andBox Components
Operating Temperature	-40℃~125℃
Tian Xian Type	Integrated, chip
Fa She Power	10dBm
Xie Yi	Bluetooth v5.3
Jie Shou Sensitivity	-104.5dBm
He Xin Xin Pian	EFR32BG21
Operating Voltage	1.71V~3.8V
Jie Kou	ADC, GPIO, I²C, I²S, IrDA, PWM, SPI, UART

Documents & Media

Resource Type	Link

Environmental & Export Classifications

Attribute	Description

Additional Resources

Attribute	Description

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