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Five major trends in terms of PCB technology development

October 22, 2019

PCB Image:Five major trends in terms of PCB technology development

More and more electronic equipments are going high-performance, high-speed, light and thin. As a multi-discipline industry, PCB technology plays a key role in high-end electronic equipment. Be it rigid, flexible or multi-layer boards with the combination of rigidity and flexibility, or module substrate with IC enclosing substrate, PCBs have made huge contributions to high-end electronic equipment. PCB field plays a crucial role in the electronic connecting technology.

Mankind has entered a highly informational society in the 21st century and PCB inevitably serves an important pillar in the information industry.

Recalling the difficult journey China’s PCB has gone through in the past 50 years, we have witnessed China’s PCB industry have made great achievements in the course of PCB development history across the globe.

In terms of Prototype PCB technology development trend, I’d like to present the following views:

1)It has developing along the path of HDI

HDI represents the most advanced PCB technology in modern times, for it makes PCB enjoy thinner wires and smaller pores. HDI is applied in end-use electronic products, such as mobile phones, which is the model for HDI cutting –edge development. When applied in the main board of mobile phones, thin and small wires (50μm~75μm/50μm~75μm, length/width) have become the mainstream. Besides, conducting layer and plates are becoming thinner and conductive diagrams are becoming micronized, which all contribute to electronic equipment with high density and higher performance.

For the past twenty years, HDI has been not only greatly promoting the development of mobile phones, LSL and CSP chips(enclosed) with the function of information processing and controlling basic frequency , as well as template substrate for enclosed use, but also stimulating the development of PCB. Therefore, it should continue to develop along the path of HDI.

2) Components embedding technology has strong vitality

Semiconductor components in the inner layer of PCB(referred to as active components), electronic components (called passive components) or passive component functions “Components embedding technology” have already begun mass production. Components embedding technology is a tremendous revolution in the integrated circuits for PCB function. If the component embedding technology wants to enjoy a better development, simulating design method should be worked out, and the issue of production technology, quality inspection and reliability guarantee is an urgent task.

We need put more investments into developing systems, such as, design, facility, testing, simulating, so as to ensure the great vitality.

3) Material development needs to go one step further

Be it rigid PCB material or flexible one, with the development of lead-free in electronic products, it has become a trend that these materials must have higher degree of heat resistance. Therefore, good materials of new high Tg, Small thermal expansion coefficient, small dielectric constant, dielectric loss angle tangent are constantly appearing in the market.

4) Photoelectric PCB is becoming more promising

Photoelectric PCB uses optical path and circuit layer to transmit signal. The key to this new technology is to create optical path layer (layer optical waveguide).It is a kind of organic polymer, which is formed by plate photocopy, laser ablation and reactive ion etching. At present, this technology has gone industrialized in Japan, the United States, etc..

5) More latest and advanced equipment need to be introduced in the manufacturing process.