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How to select the materials for PCB substrate?

March 4, 2020

PCB Image:How to select the materials for PCB substrate?

1. EN/A (Electrolytic Ni/Au)

2.OSP (Organic Solderability Preservatives)

3.IA(Immersion Ag)

4.EN/A(Electroless Ni/Au,ENIG)

5.IT (ImmersionTin)

6. Spraying tin board

1.EN/A (Electrolytic Ni/Au)

The cost of EN/A (Electrolytic Ni/Au) is the highest among all the materials, but it is the most stable of all the materials used at present, and is also the most suitable for lead-free process. Especially in producing electronic products whose price is high or requires high degree of reliability, it is advisable to use this kind of material as the substrate.

2. OSP (Organic Solderability Preservatives)

OSP production is low in cost and easy to work. But in the production process, assembling plants should amend the facility and production procedures, and the chance of similarities is low. Therefore, it is not very popular. In using this kind of substrate, protection films on the PAD can be damaged after being heated on high temperature, leading to a reduction in the tin solderability. After the second soldering, the problems on the substrate will be more serious. Therefore, if another DIP is necessary in the process, difficulty may arise in the process of soldering at the DIP ends.

3. IA(Immersion Ag)

The strong mobility of Ag in itself easily contributes to electric leakage, but the present immersion Ag is not simply the metal Ag of the past, but is a kind of organic Ag which is plated with organics. Therefore, it can meet the demands of lead-free processing in the future, whose solderability life is longer than that of OSP.

4.EN/A(Electroless Ni/Au,ENIG)

The biggest problem for this kind of substrate is black pad, so many big manufacturers refuse to use it in the lead-free process, but most of the domestic manufacturers choose to use it.

5.IT (ImmersionTin)

Easy to be contaminated and scratched, coupled with the problem of being easily oxidized in the FLUX and relative high cost, most of the domestic manufacturers do not choose it.

6. Spraying tin board

With low cost, good solderabillity and reliability, and strong compatibility, this kind of board can, however, not be used in lead-free process due to containment of lead though its solderability is good.

Besides, there is another one named spraying tin board with tin and Ag copper, which is rarely adopted by most manufacturers. Therefore, it is difficult to obtain data and information about them.