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How to distinguish the front side and back side of the PCBnewlisttop
How to distinguish the front side and back side of the PCB
Distinction between the front side and back side of single-layer PCBMany people will ask how to distinguish be...
Shovelling method of four-layer PCB
Shovelling method of four-layer PCB
Shovelled four-layer PCB refers to a PCB board whose components have all been removed with a clean surface. If...
How to reduce multi-layer board to double-layer board in PCB design?
How to reduce multi-layer board to double-layer board in PCB design?
The method of reducing multi-layer board to double-layer board in PCB designIn some Prototype PCB design, the...
How to select the materials for PCB substrate?
How to select the materials for PCB substrate?
1. EN/A (Electrolytic Ni/Au)2.OSP (Organic Solderability Preservatives)3.IA(Immersion Ag)4.EN/A(Electroless Ni...
Integrity of power in PCB circuit
Integrity of power in PCB circuit
Power integrity and signal integrity are closely related to each other. Under many circumstances, the main cau...
The method and steps of shoveling PCB
The method and steps of shoveling PCB
Firstly, after getting the PCB, you should record the model No., parameters, position of all the components on...
PCB processing technology and equipment
PCB processing technology and equipment
PCB equipment includes plating wires, electroless plating copper, DES wires, DES wires, cleaning machines, OSP...
Processing technique of SMD
Processing technique of SMD
1. Based on Gerber and BOM from the client, technology files are prepared to generate coordinate files.2. Be s...
PCBA test
PCBA test
PCBA test is the most crucial quality control step in the entire PCBA processing procedure, which should be in...
Several important elements in the later check of PCB design
Several important elements in the later check of PCB design
When the routing in finished on one PCB Prototyping board and there is no error in both the connecting and th...

PCB processing technology and equipment

December 30, 2019

PCB Image:PCB processing technology and equipment

PCB equipment includes plating wires, electroless plating copper, DES wires, DES wires, cleaning machines, OSP lines, electroless nickel gold wires, press machines, exposure machines, roasting machines, AOI, twist bump-cutter machine, edging machines, materials providing machines, vacuum packaging machines, hammering machines, drilling machines, vacuum pressing machines, tin spraying machines, CMI series, light drawing machines, etc..

Circuit board can be divided into single-layer board, multi-layer board and multi-layer printing board. The basic production process of single-layer boards are as follows:

Foil coating board -- > preparing materials --> drying plate (to prevent deformation) -- > preparing mould -- > cleaning and drying > sticker (or screen printing) - > exposure imaging (or corrosion resistant ink) - > etching --> striping coating-- > on-off test of the electrical products - > cleaning - > screen printing resistance welding graphics (printing green oil) -- > solidification-- > screen printing the mark --> solidification -- > holes drilling > shape processing -- -- > drying and cleaning > inspection -- > packing -- > finished products.

The basic production process of double-layer boards are as follows:

The graphics electroplating process:

Foil coating board -- > preparing materials -- > basic holes drilling -- > inspection -- > deburring - > thin copper coating with physical method-- -- > thin copper electroplating > inspection -- > brushing board-- > sticker (or screen printing) - > exposure imaging (or solidification) - > inspecting and repairing board - > graphics electroplating (Cn十Sn/Pb) -- > striping coating -- > etching --> inspecting and repairing board -- > nickel and gold plating in the socket -- > hot fusion cleaning > on-off test of the electrical products --> cleaning process --> screen printing resistance welding graphics -- > solidification-- > screen printing the mark --> solidification --> shape processing -- -- > drying and cleaning > inspection -- > packing -- > finished products.

The advantage of Solder Mask On Bare Copper (SMOBC) is it can solve the problem of short circuit in the solder connecting process. As the proportion between lead and tin is fixed, it has better solderability and storage than hot fusion boards. The technology of removing lead and tin by SMOBC is similar to graphics electroplating process, which will makes changes only after itching. Double-layer copper foil board - >from graphics electroplating process to etching process -- -- > removing lead and tin -- - > inspection -- - > cleaning -- - > resistance welding graphics - > nickel and gold plating on the socket -- > sticking tape on the socket -- > Hot-air solder leveling -- > cleaning > screen printing the mark --> solidification --> shape processing -- -- > drying and cleaning > finished products inspection -- > packing -- > finished products.