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How to distinguish the front side and back side of the PCBnewlisttop
How to distinguish the front side and back side of the PCB
Distinction between the front side and back side of single-layer PCBMany people will ask how to distinguish be...
Shovelling method of four-layer PCB
Shovelling method of four-layer PCB
Shovelled four-layer PCB refers to a PCB board whose components have all been removed with a clean surface. If...
How to reduce multi-layer board to double-layer board in PCB design?
How to reduce multi-layer board to double-layer board in PCB design?
The method of reducing multi-layer board to double-layer board in PCB designIn some Prototype PCB design, the...
How to select the materials for PCB substrate?
How to select the materials for PCB substrate?
1. EN/A (Electrolytic Ni/Au)2.OSP (Organic Solderability Preservatives)3.IA(Immersion Ag)4.EN/A(Electroless Ni...
Integrity of power in PCB circuit
Integrity of power in PCB circuit
Power integrity and signal integrity are closely related to each other. Under many circumstances, the main cau...
The method and steps of shoveling PCB
The method and steps of shoveling PCB
Firstly, after getting the PCB, you should record the model No., parameters, position of all the components on...
PCB processing technology and equipment
PCB processing technology and equipment
PCB equipment includes plating wires, electroless plating copper, DES wires, DES wires, cleaning machines, OSP...
Processing technique of SMD
Processing technique of SMD
1. Based on Gerber and BOM from the client, technology files are prepared to generate coordinate files.2. Be s...
PCBA test
PCBA test
PCBA test is the most crucial quality control step in the entire PCBA processing procedure, which should be in...
Several important elements in the later check of PCB design
Several important elements in the later check of PCB design
When the routing in finished on one PCB Prototyping board and there is no error in both the connecting and th...

Processing technique of SMD

December 23, 2019

PCB Image:Processing technique of SMD

1. Based on Gerber and BOM from the client, technology files are prepared to generate coordinate files.

2. Be sure to check whether all production materials are prepared well and whether the production sheets are ready. Besides, PMC production plan should also be confirmed.

3. After programming SMT, be sure to check the stem board to make sure they are all right.

4. Production of steel mesh should be based on SMT technique.

5. Tin cream should be applied to ensure tin cream is even and consistent with proper thickness.

6. Electronic components are stuck to the circuit board through SMT machines and online AOI automatic optical detection is conducted when necessary.

7. A perfect return soldering curves should be laid out to ensure that they go through return soldering. In this way, tin cream will transform from cream to liquid, then to solid, and soldering will become effective after cooling.

8. Be sure to pass IPQC inspection.

9. Plug-in materials are passed through the circuit board by employing DIP plug-in technique, and are welded after the processing of wave soldering.

10. After soldering processing is also necessary, such as, pins cutting, post soldering, board surface cleaning, etc..

11. The final step is to conduct a comprehensive QA inspection to make sure the quality is good.