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The method and steps of shoveling PCB

January 6, 2020

PCB Image:The method and steps of shoveling PCB

Firstly, after getting the PCB, you should record the model No., parameters, position of all the components on it, especially the direction of diode and triode, as well as the direction of IC gap. It is advisable to take some pictures of the position of the electronic components by digital camera.

Secondly, both all components should be removed and the tin hidden inside the PAD holes should be removed. Besides, PCB Prototype should be cleaned with ethyl alcohol and put inside the scanister. When scanning with scanisters, pixel should be enhanced in order to get a clear image and start POHTOSHOP, after which silk screen side is scanned with color scanning and then the files can be printed out for later use.

Thirdly, water paper making can be used to polish the layers of TOPLAYER and BOTTOMLAYER until copper coating is brightened. Please be noted that layout inside scanister should be both horizontal and vertical, or the scanned images can’t be employed. The files should also be saved.

Fourthly, contrast ratio and intensity of the canvas should be adjusted well so that the part with copper and non-copper part should form a clear contrast, after which the color of images should be transformed into black and whiter to check whether lines are clear or not. If they are not clear, the above steps should be repeated. If they are clear, images should be saved in black and white with the format of BMP, such as, TOP.BMP and BOT.BMP. If there are problems with the image, they can also be amended or repaired with PHOTOSHOP.

Fifthly, the format of the two BMP files should be changed in the format of PROTEL, in which there should be two layers. If the position of PAD and VIA coincides with each, it means the previous steps are in good progress. If not, the third step should be repeated.

Sixthly, the top layer of BMP should be changed into TOP.PCB. Be sure to change it to SILK layer which is also the yellow layer, then drawing can begin in the TOP layer and components should be placed according to graphs in the second step. After the drawing is finished, SILK layer can be removed.

Seventhly, BMP in the BOT layer should be changed into BOT.PCB. Be sure to change it to SILK layer which is also the yellow layer, then drawing can begin in the BOT layer. After the drawing is finished, SILK layer can be removed.

Eighthly, TOP.PCB and BOT.PCB should be moved into PROTEL and be combined into one image.

Ninthly, TOPLAYER and BOTTOMLAYER should be printed on the transparent tape by laser printing machines (in a proportion of 1:1). After that, the tape should be put on PCB for comparison to see whether it is OK. If yes, all the steps are finished.